董浩

2024年08月28日 11:04  点击:[]

基本信息

姓名:董浩                                                             出生年月:19907     

学历:博士研究生                                                  学位:工学博士       

职称:讲师                                              邮箱:hdong@mail.nwpu.edu.cn

公司:伟德国际BETVlCTORAPP官网                                         专业:金属材料工程

                                           

学习经历

2016年至2020  西北工业大学  博士

2014年至2016  西北工业大学  硕士

2010年至2014  伟德国际BETVlCTORAPP官网  学士

工作经历

20211月至今 伟德国际BETVlCTORAPP官网 讲师

招生信息

每年招收硕士生2

公司产品

主讲课程:《材料成形三维建模与模拟仿真》《金属材料与热处理》

研究方向

高强耐热铝合金/铝基复合材料

先进金属层状复合材料

非平衡凝固理论

科研项目

1、国家自然科学基金青年项目(No.52101049),多层累积叠轧层状复合材料的界面结构演化与稳定化机理,2022-012024-1230万元,主持

2、陕西省教育厅青年创新团队科研计划项目(No. 23JP063),高强耐热铸造铝基复合材料及其应用技术,2023-012024-12, 5万元,主持

3、陕西省科技厅自然科学基金青年项目(No. 2022JQ-500),高强高导和高热稳定纳米结构Ag/Cu层状材料的可控制备研究,2022-012023-12, 5万元,主持

4、中央军委科技委基础加强计划(No. G20210617),****的机理研究与应用,202011月至202411月,252万元,参与

5、国家国防科工局***替代专项(No. 51771153),***铝合金铸件研制,2017-12021-122523万元,参与

发表论文

[1]   H. Dong, Y.Z. Chen, K. Wang, G.B. Shan, Z.R. Zhang, K. Huang, F. Liu. In situ observation of remelting induced anomalous eutectic structure formation in an undercooled Ni-18.7 at.% Sn eutectic alloy, Scripta Materialia 177 (2020) 123-127 (ESIHot Paper”论文;ESI高被引论文).

[2]   H. Dong, Y.C. Guo, Y.Z. Chen, F. Xia, Q.Q. Guo, Q. Chen, G.L. Li, J.Y. Zhao, Y. Zhong, J.P. Li. On the mechanism of Si-promoted destabilization of TiCx particles in Al alloys, Journal of Materials Science & Technology 165 (2023) 17-26.

[3]   H. Dong, Y.C. Guo, D. Zhu, G.B. Shan, G.Y. Yang, Y.Z. Chen, In situ observation of destabilization of a nanostructured Ag/Cu multilayer fabricated via multicomponent accumulative roll bonding, Materials & Design 236 (2023) 112487.

[4]   H. Dong, Y.Z. Chen, Y.C. Guo, G.B. Shan, G.Y. Yang, L.K. Huang, F. Liu, Q. Li. A nanostructured Ag/Cu multilayered composite exhibiting high hardness and high electrical conductivity prepared by a novel multicomponent accumulative roll bonding, Materials Characterization 196 (2023) 112613.

[5]   H. Dong, Y.Z. Chen, Z.R. Zhang, G.B. Shan, W.X. Zhang, F. Liu. Mechanisms of eutectic lamellar destabilization upon rapid solidification of an undercooled Ag-39.9 at.% Cu eutectic alloy, Journal of Materials Science & Technology 59 (2020) 173-179 (期刊封面论文).

[6]   H. Dong, Y.Z. Chen, G.B. Shan, Z.R. Zhang, F. Liu. On the nonequilibrium interface kinetics of rapid coupled eutectic growth, Metallurgical and Materials Transactions A 48 (2017) 3823-3830.

[7]   H. Dong, Y.Z. Chen,  K. Wang, G.B. Shan, Z.R. Zhang, W.X. Zhang, F. Liu. Modeling remelting induced destabilization of lamellar eutectic structure in an undercooled Ni-18.7 at.% Sn eutectic alloy, Journal of Alloys and Compounds 826 (2020) 154018.

[8]   Q. Chen*, H. Dong*, Y. Xie, Z.X. Yan, J. Xu, F. Gao, Effect of Ti4+ and Pb2+ on negative thermal expansion and polarization behaviors of KSr2Nb5O15: First-principles investigation, Materials Today Communications 38 (2024) 108509.

[9]   Y.Z. Chen, K. Wang, G.B. Shan, A. Ceguerra, L.K. Huang, H. Dong, L.F. Cao, S. Ringer, F. Liu. Grain size stabilization of mechanically alloyed nanocrystalline Fe-Zr alloys by forming highly dispersed coherent Fe-Zr-O nanoclusters, Acta Materialia 158 (2018) 340-353. 

[10]          G.B. Shan, Y.Z. Chen, Y.J. Li, H. Dong, W.X. Zhang, T. Suo, F. Liu. High temperature creep resistance of a thermally stable nanocrystalline Fe-5 at.%Zr steel, Scripta Materialia 179 (2020) 1-5.

[11]          G.B. Shan, Y.Z. Chen, M.M. Gong, H. Dong, L. Bo, F. Liu. Influence of Al2O3 particle pinning on thermal stability of nanocrystalline Fe, Journal of Materials Science & Technology 34 (2018) 25-30.

[12]          G.B. Shan, Y.Z. Chen, M.M. Gong, H. Dong, F. Liu. Modelling thermodynamics of nanocrystalline binary interstitial alloys, Journal of Materials Science & Technology 4 (2018) 613-619.

[13]          G.B. Shan, Y.Z. Chen, N.N. Liang, H. Dong, W.X. Zhang, T. Suo, F. Liu. Irradiation resistance of a thermally stable nanocrystalline Fe-1 at.% Zr alloy, Materials Letters 238 (2019) 261-263.

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